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This Japanese Industrial Standard specifies the electroless copper plating (hereafter referred to as the 'plating') 5 mum or thicker used for printed wiring boards by additive process.
| Author | JSA |
|---|---|
| Editor | JSA |
| Document type | Standard |
| Format | File |
| Confirmation date | 2015-10-20 |
| ICS | 25.220.40 : Metallic coatings
77.120.30 : Copper and copper alloys |
| Number of pages | 15 |
| Set | Metal Surface Treatment-2013 |
| Year | 1990 |
| Document history | |
| Country | Japan |
| Keyword | JIS 8646;8646;JIS H 8646-1991 |